SFFSAZ7 December   2025 TMP175-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC-8 Package
    2. 2.2 VSSOP-8 Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
  7. 5Revision History

1 Overview

This document contains information for the TMP175-Q1 (SOIC-8 and VSSOP-8 packages) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

TMP175-Q1 Functional Block Diagram Figure 1-1 Functional Block Diagram

The TMP175-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.