SGLS162J April   2003  – June 2025 TPS793-Q1

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1 Absolute Maximum Ratings
   2. 5.2 ESD Ratings
   3. 5.3 Recommended Operating Conditions
   4. 5.4 Thermal Information
   5. 5.5 Electrical Characteristics
   6. 5.6 Typical Characteristics
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagrams
   3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout (UVLO)
      2. 6.3.2 Shutdown
      3. 6.3.3 Foldback Current Limit
      4. 6.3.4 Thermal Protection
      5. 6.3.5 Reverse Current Operation
   4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
8. 7 Application and Implementation
   1. 7.1 Application Information
      1. 7.1.1 Exiting Dropout
   2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
         1. 7.2.2.1 External Capacitor Requirements
         2. 7.2.2.2 Adjustable Operation
            1. 7.2.2.2.1 Adjustable Operation (Legacy Chip)
            2. 7.2.2.2.2 Adjustable Operation (New Chip)
      3. 7.2.3 Application Curves
   3. 7.3 Power Supply Recommendations
   4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
         1. 7.4.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
         2. 7.4.1.2 Power Dissipation and Junction Temperature
      2. 7.4.2 Layout Example
9. 8 Device and Documentation Support
   1. 8.1 Device Support
      1. 8.1.1 Development Support
         1. 8.1.1.1 Evaluation Modules
         2. 8.1.1.2 Spice Models
      2. 8.1.2 Device Nomenclature
   2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
   3. 8.3 Receiving Notification of Documentation Updates
   4. 8.4 Support Resources
   5. 8.5 Trademarks
   6. 8.6 Electrostatic Discharge Caution
   7. 8.7 Glossary
10. 9 Revision History
11. 10Mechanical, Packaging, and Orderable Information