SGLS247C September   2011  – December 2025 TPS763-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Output Pulldown
      5. 6.3.5 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Adjustable Device Feedback Resistors
      2. 7.1.2 Recommended Capacitor Types
        1. 7.1.2.1 Recommended Capacitors (Legacy Chip)
        2. 7.1.2.2 Recommended Capacitors (New Chip)
      3. 7.1.3 Input and Output Capacitor Requirements
        1. 7.1.3.1 Input Capacitor Requirements
        2. 7.1.3.2 Output Capacitor Requirements
      4. 7.1.4 Reverse Current
      5. 7.1.5 Feed-Forward Capacitor (CFF)
      6. 7.1.6 Power Dissipation (PD)
      7. 7.1.7 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Output Voltage Programming
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Power Dissipation and Junction Temperature
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Device Nomenclature
      2. 8.2.2 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) Legacy chip New chip UNIT
SOT-23 (DBV) SOT-23 (DBV)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 205.2 178.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 11.93 77.9 °C/W
RθJB Junction-to-board thermal resistance 34.8 47.2 °C/W
ΨJT Junction-to-top characterization parameter 12.2 15.9 °C/W
ΨJB Junction-to-board characterization parameter 33.9 46.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.