SLAS916C November   2012  – November 2014 RF430CL330H

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Typical Application Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Recommended Operating Conditions, Resonant Circuit
    5. 4.5  Supply Currents
    6. 4.6  Digital Inputs
    7. 4.7  Digital Outputs
    8. 4.8  Thermal Characteristics
    9. 4.9  Serial Communication Protocol Timings
    10. 4.10 I2C Interface
    11. 4.11 SPI Interface
    12. 4.12 RF143B, Recommended Operating Conditions
    13. 4.13 RF143B, ISO14443B ASK Demodulator
    14. 4.14 RF143B, ISO14443B-Compliant Load Modulator
    15. 4.15 RF143B, Power Supply
  5. 5Detailed Description
    1. 5.1  Functional Block Diagram
    2. 5.2  Serial Communication Interface
    3. 5.3  SPI or I2C Mode Selection
    4. 5.4  Communication Protocol
    5. 5.5  I2C Protocol
      1. 5.5.1 BIP-8 Communication Mode With I2C
    6. 5.6  SPI Protocol
      1. 5.6.1 BIP-8 Communication Mode With SPI
    7. 5.7  Registers
      1. 5.7.1 General Control Register
      2. 5.7.2 Status Register
      3. 5.7.3 Interrupt Registers
      4. 5.7.4 CRC Registers
      5. 5.7.5 Communication Watchdog Register
      6. 5.7.6 Version Registers
    8. 5.8  NFC Type-4 Tag Functionality
      1. 5.8.1 ISO14443-3 Commands
      2. 5.8.2 NFC Tag Type 4 Commands
      3. 5.8.3 Data Rate Settings
    9. 5.9  NDEF Memory
      1. 5.9.1 NDEF Error Check
    10. 5.10 Typical Usage Scenario
    11. 5.11 References
  6. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
        1. 6.1.1.1 Getting Started and Next Steps
      2. 6.1.2 Device and Development Tool Nomenclature
    2. 6.2 Documentation Support
    3. 6.3 Community Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  7. 7Mechanical Packaging and Orderable Information
    1. 7.1 Packaging Information

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

TI E2E Community : e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright© 2014, Texas Instruments Incorporated