SLASEQ6A Septmeber   2018  – June 2019 HD3SS3212-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 High-Speed Performance Parameters
    7. 6.7 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Enable and Power Savings
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Down Facing Port for USB3.1 Type C
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Systems Examples
      1. 9.3.1 Up Facing Port for USB 3.2 Type C
      2. 9.3.2 PCIe/SATA/USB
      3. 9.3.3 PCIE/eSATA
      4. 9.3.4 USB/eSATA
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC Device active current VCC = 3.3 V, OEn = 0 0.5 0.8 mA
ISTDN Device shutdown current VCC = 3.3 V, OEn = VCC 0.005 1 µA
CON Output ON capacitance to GND 0.6 pF
COFF Output OFF capacitance to GND 0.8 pF
RON Output ON resistance VCC = 3.3 V; VCM = 0 to 2 V;
IO = –8 mA		 5 8 Ω
ΔRON On-resistance match between pairs of the same channel VCC = 3.3 V; –0.35 V ≤ VIN ≤ 2.35 V; IO = –8 mA 0.7 Ω
RFLAT_ON On-resistance flatness RON(MAX) – RON(MIN) VCC = 3.3 V; –0.35 V ≤ VIN ≤ 2.35 V 1 Ω
IIH,CTRL Input high current, control pins (SEL, OEn) 1 µA
IIL,CTRL Input low current, control pins (SEL, OEn) 1 µA
IIH,HS Input high current, high-speed pins [Ax/Bx/Cx][p/n] VIN = 2 V for selected port, A and B with SEL = 0, and A and C with
SEL = VCC 		1 µA
IIH,HS Input high current, high-speed pins [Ax/Bx/Cx][p/n] VIN = 2 V for non-selected port, C with SEL = 0, and B with
SEL = VCC(1) 		100 140 µA
IIL,HS Input low current, high-speed pins [Ax/Bx/Cx][p/n] 1 µA
(1) There is a 20-kΩ pull-down in non-selected port.