SLASEX7B June   2021  – April 2025 TAS5828M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
      1. 5.7.1 Bridge Tied Load (BTL) Configuration Curves with BD Modulation
      2. 5.7.2 Bridge Tied Load (BTL) Configuration Curves with 1SPW Modulation
      3. 5.7.3 Parallel Bridge Tied Load (PBTL) Configuration With BD Modulation
      4. 5.7.4 Parallel Bridge Tied Load (PBTL) Configuration With 1SPW Modulation
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supplies
      2. 7.3.2 Device Clocking
      3. 7.3.3 Serial Audio Port – Clock Rates
      4. 7.3.4 Clock Halt Auto-recovery
      5. 7.3.5 Sample Rate on the Fly Change
      6. 7.3.6 Serial Audio Port - Data Formats and Bit Depths
      7. 7.3.7 Digital Audio Processing
      8. 7.3.8 Class D Audio Amplifier
        1. 7.3.8.1 Speaker Amplifier Gain Select
        2. 7.3.8.2 Class D Loop Bandwidth and Switching Frequency Setting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Software Control
      2. 7.4.2 Speaker Amplifier Operating Modes
        1. 7.4.2.1 BTL Mode
        2. 7.4.2.2 PBTL Mode
      3. 7.4.3 Low EMI Modes
        1. 7.4.3.1 Spread Spectrum
        2. 7.4.3.2 Channel to Channel Phase Shift
        3. 7.4.3.3 Multi-Devices PWM Phase Synchronization
          1. 7.4.3.3.1 Phase Synchronization With I2S Clock In Startup Phase
          2. 7.4.3.3.2 Phase Synchronization With GPIO
      4. 7.4.4 Thermal Foldback
      5. 7.4.5 Device State Control
      6. 7.4.6 Device Modulation
        1. 7.4.6.1 BD Modulation
        2. 7.4.6.2 1SPW Modulation
        3. 7.4.6.3 Hybrid Modulation
    5. 7.5 Programming and Control
      1. 7.5.1 I2 C Serial Communication Bus
      2. 7.5.2 Hardware Control Mode
      3. 7.5.3 I2 C Target Address
        1. 7.5.3.1 Random Write
        2. 7.5.3.2 Sequential Write
        3. 7.5.3.3 Random Read
        4. 7.5.3.4 Sequential Read
        5. 7.5.3.5 DSP Memory Book, Page and BQ update
        6. 7.5.3.6 Checksum
          1. 7.5.3.6.1 Cyclic Redundancy Check (CRC) Checksum
          2. 7.5.3.6.2 Exclusive or (XOR) Checksum
      4. 7.5.4 Control via Software
        1. 7.5.4.1 Startup Procedures
        2. 7.5.4.2 Shutdown Procedures
      5. 7.5.5 Protection and Monitoring
        1. 7.5.5.1 Overcurrent Limit (Cycle-By-Cycle)
        2. 7.5.5.2 Overcurrent Shutdown (OCSD)
        3. 7.5.5.3 DC Detect Error
        4. 7.5.5.4 Overtemperature Shutdown (OTSD)
        5. 7.5.5.5 PVDD Overvoltage and Undervoltage Error
        6. 7.5.5.6 PVDD Drop Detection
        7. 7.5.5.7 Clock Fault
  9. 8 Register Maps
    1. 8.1 CONTROL PORT Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Inductor Selections
      2. 9.1.2 Bootstrap Capacitors
      3. 9.1.3 Power Supply Decoupling
      4. 9.1.4 Output EMI Filtering
    2. 9.2 Typical Applications
      1. 9.2.1 2.0 (Stereo BTL) System
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design procedures
        1. 9.2.3.1 Step One: Hardware Integration
        2. 9.2.3.2 Step Two: Hardware Integration
        3. 9.2.3.3 Step Three: Software Integration
      4. 9.2.4 MONO (PBTL) Systems
      5. 9.2.5 Advanced 2.1 System (Two TAS5828M Devices)
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 DVDD Supply
      2. 9.3.2 PVDD Supply
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 General Guidelines for Audio Amplifiers
        2. 9.4.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
        3. 9.4.1.3 Optimizing Thermal Performance
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Device Nomenclature
      2. 10.1.2 Development Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.2.2 Design Requirements

  • Power supplies:
    • 3.3V supply
    • 5V to 24V supply
  • Communication: host processor serving as I2C compliant controller
  • External memory (such as EEPROM and FLASH) used for coefficients.

The requirements for the supporting components for the TAS5828M device in a Stereo 2.0 (BTL) system is provide in Table 9-2.

Table 9-2 Supporting Component Requirements for Stereo 2.0 (BTL) Systems
REFERENCE DESIGNATORVALUESIZEDETAILED DESCRIPTION
C8, C9 390µF SMD CAP, AL, 390uF, 35V, ± 20%, SMD
C4,C5 0.1µF 0402 CAP, CERM, 10uF, 35V, ± 10%, X5R, 0805
C2,C3, C6, C7 10µF 0805 CAP,CERM, 22µF, 35V, ±20%, JB, 0805
C11 4.7µF 0603 CAP,CERM, 4.7µF, 10V, ±10%, X5R, 0603
C12 0.1µF 0603 CAP,CERM, 0.1µF, 16V, ±10%, X7R, 0603
C15,C17, C19 1µF 0603 CAP,CERM, 1µF, 16V, ±10%, X5R, 0603
C14,C16, C18, C20 0.47µF 0603 CAP,CERM, 0.47µF, 16V, ±10%, X7R, 0603
C1,C10, C13, C21 0.68µF 0805 CAP,CERM, 0.68µF, 50V, ±10%, X7R, 0805
L1,L2, L3, L4 10µH Inductor, Shielded Drum Core, Ferrite, 10uH, 7.1A, 0.01294ohm, SMD, 7447709100
R1, R6 0Ω 0402 RES,0, 5%, 0.063W, 0402
R2,R4, R5 10kΩ 0402 RES,10.0k, 1%, 0.063W, 0402
R3 1kΩ 0402 RES,1.0k, 1%, 0.063W, 0402