SLAU873E January   2023  – September 2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
    5. 1.5 Software Examples
    6. 1.6 First Step: Out-of-Box Experience
      1. 1.6.1 Connecting to the Computer
      2. 1.6.2 Running the Out-of-Box Experience
    7. 1.7 Next Steps: Looking Into the Provided Code
  6. 2Hardware
    1. 2.1 Jumper Map
    2. 2.2 Block Diagram
    3. 2.3 Hardware Features
      1. 2.3.1 MSPM0G3507 MCU
      2. 2.3.2 XDS110-ET Onboard Debug Probe With EnergyTrace Technology
      3. 2.3.3 Debug Probe Connection Isolation Jumper Block
      4. 2.3.4 Application (or Backchannel) UART
      5. 2.3.5 Using an External Debug Probe Instead of the Onboard XDS110-ET
      6. 2.3.6 Using the XDS110-ET Debug Probe With a Different Target
      7. 2.3.7 Special Features
        1. 2.3.7.1 Up to 4-Msps High-Speed Analog-to-Digital Converter
        2. 2.3.7.2 Thermistor
        3. 2.3.7.3 Light Sensor
    4. 2.4 Power
      1. 2.4.1 XDS110-ET USB Power
    5. 2.5 External Power Supply and BoosterPack Plug-in Module
    6. 2.6 Measure Current Draw of the MSPM0 MCU
    7. 2.7 Clocking
    8. 2.8 BoosterPack Plug-in Module Pinout
  7. 3Software Examples
  8. 4Resources
    1. 4.1 Integrated Development Environments
      1. 4.1.1 TI Cloud Development Tools
      2. 4.1.2 TI Resource Explorer Cloud
      3. 4.1.3 Code Composer Studio Cloud
      4. 4.1.4 Code Composer Studio IDE
    2. 4.2 MSPM0 SDK and TI Resource Explorer
    3. 4.3 MSPM0G3507 MCU
      1. 4.3.1 Device Documentation
      2. 4.3.2 MSPM0G3507 Code Examples
    4. 4.4 Community Resources
      1. 4.4.1 TI E2E™ Forums
  9. 5Hardware Design Files
    1. 5.1 Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  10. 6Additional Information
    1.     Trademarks
  11. 7Revision History

3 Software Examples

See the MSPM0 SDK documentation for more details about available software.