SLAZ755C May   2024  – November 2025 MSPM0L1227 , MSPM0L1227-Q1 , MSPM0L1228 , MSPM0L1228-Q1 , MSPM0L2227 , MSPM0L2227-Q1 , MSPM0L2228 , MSPM0L2228-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Functional Advisories
  5. 2Preprogrammed Software Advisories
  6. 3Debug Only Advisories
  7. 4Fixed by Compiler Advisories
  8. 5Device Nomenclature
    1. 5.1 Device Symbolization and Revision Identification
  9. 6Advisory Descriptions
    1. 6.1  ADC_ERR_05
    2. 6.2  ADC_ERR_06
    3. 6.3  AES_ERR_01
    4. 6.4  COMP_ERR_03
    5. 6.5  COMP_ERR_04
    6. 6.6  CPU_ERR_01
    7. 6.7  CPU_ERR_02
    8. 6.8  CPU_ERR_03
    9. 6.9  GPIO_ERR_03
    10. 6.10 GPIO_ERR_04
    11. 6.11 I2C_ERR_01
    12. 6.12 I2C_ERR_03
    13. 6.13 I2C_ERR_04
    14. 6.14 I2C_ERR_05
    15. 6.15 I2C_ERR_06
    16. 6.16 I2C_ERR_07
    17. 6.17 I2C_ERR_08
    18. 6.18 I2C_ERR_09
    19. 6.19 I2C_ERR_10
    20. 6.20 I2C_ERR_13
    21. 6.21 KEYSTORE_ERR_01
    22. 6.22 LCD_ERR_01
    23. 6.23 LFSS_ERR_01
    24. 6.24 LFSS_ERR_02
    25. 6.25 LFSS_ERR_03
    26. 6.26 LFXT_ERR_01
    27. 6.27 LFXT_ERR_02
    28. 6.28 PMCU_ERR_08
    29. 6.29 PMCU_ERR_09
    30. 6.30 PMCU_ERR_10
    31. 6.31 RST_ERR_01
    32. 6.32 RTC_A_ERR_02
    33. 6.33 SPI_ERR_03
    34. 6.34 SPI_ERR_04
    35. 6.35 SPI_ERR_05
    36. 6.36 SPI_ERR_06
    37. 6.37 SPI_ERR_07
    38. 6.38 SRAM_ERR_01
    39. 6.39 SYSCTL_ERR_01
    40. 6.40 SYSCTL_ERR_02
    41. 6.41 SYSCTL_ERR_03
    42. 6.42 SYSCTL_ERR_04
    43. 6.43 SYSOSC_ERR_01
    44. 6.44 TAMPERIO_ERR_01
    45. 6.45 TIMER_ERR_01
    46. 6.46 TIMER_ERR_04
    47. 6.47 TIMER_ERR_06
    48. 6.48 TIMER_ERR_07
    49. 6.49 UART_ERR_01
    50. 6.50 UART_ERR_02
    51. 6.51 UART_ERR_03
    52. 6.52 UART_ERR_04
    53. 6.53 UART_ERR_05
    54. 6.54 UART_ERR_06
    55. 6.55 UART_ERR_07
    56. 6.56 UART_ERR_08
    57. 6.57 UART_ERR_09
    58. 6.58 UART_ERR_10
    59. 6.59 UART_ERR_11
  10. 7Revision History

5 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully qualified production devices (MSP).

XMS – Experimental device that is not necessarily representative of the final device's electrical specifications

MSP – Fully qualified production device

Support tool naming prefixes:

X: Development-support product that has not yet completed Texas Instruments internal qualification testing.

null: Fully-qualified development-support product.

XMS devices and X development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature range, package type, and distribution format.