SLLS682P July   2006  – January 2025 TPD4E001

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings—JEDEC Specification
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
  9.   Power Supply Recommendations
  10. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  12. 10Revision History
  13. 11Mechanical, Packaging, and Orderable Information

5.5 Thermal Information

THERMAL METRIC(1)TPD4E001UNIT
DRL (SOT)DBV (SOT)DCK (SC70)DPK (USON)DRS (SON)
6 PINS6 PINS6 PINS6 PINS6 PINS
RθJAJunction-to-ambient thermal resistance226.4259.7251.1247.691.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance90.3186.588.1124.8106.9°C/W
RθJBJunction-to-board thermal resistance61.2107.654.8204.264.8°C/W
ψJTJunction-to-top characterization parameter6.771.41.719.210.2°C/W
ψJBJunction-to-board characterization parameter61107.154.1209.364.9°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/A29.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.