SLLSEH3D July   2013  – September 2025 SN65HVD888

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings: JEDEC Specifications
    3. 5.3 ESD Ratings: IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Power Dissipation Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. Parameter Measurement information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low-Power Standby Mode
      2. 7.3.2 Bus Polarity Correction
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Configuration
      2. 8.1.2 Bus Design
      3. 8.1.3 Cable Length Versus Data Rate
      4. 8.1.4 Stub Length
      5. 8.1.5 3 to 5V Interface
      6. 8.1.6 Noise Immunity
      7. 8.1.7 Transient Protection
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Design and Layout Considerations For Transient Protection
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

ESD Ratings: JEDEC Specifications

VALUEUNIT
V(ESD)Electrostatic dischargeHuman body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±8000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±1500
Machine model (MM)±100
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.