SLLSEH3D July   2013  – September 2025 SN65HVD888

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings: JEDEC Specifications
    3. 5.3 ESD Ratings: IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Power Dissipation Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low-Power Standby Mode
      2. 7.3.2 Bus Polarity Correction
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Configuration
      2. 8.1.2 Bus Design
      3. 8.1.3 Cable Length Versus Data Rate
      4. 8.1.4 Stub Length
      5. 8.1.5 3 to 5V Interface
      6. 8.1.6 Noise Immunity
      7. 8.1.7 Transient Protection
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Design and Layout Considerations For Transient Protection
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision C (January 2018) to Revision D (September 2025)

  • Changed all instances of legacy terminology to controller and peripheral where mentioned.Go
  • Removed the 1K resister in R Output of Figure 7-3 Go

Changes from Revision B (June 2017) to Revision C (January 2018)

  • Changed the Device Information table to the Package Information tableGo
  • Changed 3.3 VISO To: 5VISO in Figure 8-9 Go

Changes from Revision A (September 2015) to Revision B (June 2017)

  • Changed text From: "characterized from –40°C to 85°C" To: "characterized from –40°C to 125°C" in the Description Go
  • Changed the TA MAX value From: 85°C To: 125°C in the Recommended Operating Conditions tableGo
  • Changed ICC to show values for the temperature ranges of –40°C to 85°C and –40°C to 125°C in the Electrical Characteristics tableGo

Changes from Revision * (July 2013) to Revision A (September 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed JEDEC Standard 22, Test Method A114 (HBM) from ±4 to ±8 kV.Go
  • Changed JEDEC Standard 22, Test Method A115 (Machine Model) from ±100 to ±200 V.Go
  • Changed the "D and RE Inputs" circuit and the "DE Input" circuit of Figure 7-3 Go