SLLSEH3D July   2013  – September 2025 SN65HVD888

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings: JEDEC Specifications
    3. 5.3 ESD Ratings: IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Power Dissipation Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. Parameter Measurement information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low-Power Standby Mode
      2. 7.3.2 Bus Polarity Correction
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Configuration
      2. 8.1.2 Bus Design
      3. 8.1.3 Cable Length Versus Data Rate
      4. 8.1.4 Stub Length
      5. 8.1.5 3 to 5V Interface
      6. 8.1.6 Noise Immunity
      7. 8.1.7 Transient Protection
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Design and Layout Considerations For Transient Protection
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Absolute Maximum Ratings

(see (1))
MINMAXUNIT
VCCSupply voltage–0.57V
Input voltage at any logic pin–0.35.7V
Voltage input, transient pulse, A and B, through 100Ω–100100V
Voltage at A or B inputs–1818V
Receiver output current–2424mA
Continuous total-power dissipationSee (Thermal Information) table
TJJunction temperature170°C
TSTGStorage temperature–65150°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Section 5.4 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.