SLLSFK3A November   2022  – August 2026 ISOW7741-Q1 , ISOW7742-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics - Power Converter
    10. 5.10 Supply Current Characteristics - Power Converter
    11. 5.11 Electrical Characteristics Channel Isolator - VIO, VISOIN = 5-V
    12. 5.12 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 5-V
    13. 5.13 Electrical Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
    14. 5.14 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
    15. 5.15 Electrical Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
    16. 5.16 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
    17. 5.17 Electrical Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
    18. 5.18 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
    19. 5.19 Switching Characteristics - 5-V Supply
    20. 5.20 Switching Characteristics - 3.3-V Supply
    21. 5.21 Switching Characteristics - 2.5-V Supply
    22. 5.22 Switching Characteristics - 1.8-V Supply
    23. 5.23 Insulation Characteristics Curves
    24. 5.24 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Power Isolation
      2. 7.1.2 Signal Isolation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 7.3.2 Power-Up and Power-Down Behavior
      3. 7.3.3 Protection Features
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

1 Features

  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature Grade 1: –40°C to +125°C ambient temperature range
  • 100Mbps data rate
  • Integrated DC-DC converter with low-emissions, low-noise
    • Emission optimized to meet CISPR25
    • Low frequency power converter at 25MHz enabling low noise performance
    • Low output ripple: 24mV
  • High efficiency output power
    • Efficiency at max load: 46%
    • Up to 0.55W output power
    • VISOOUT accuracy of 5%
    • 5V to 5V: Max available load current = 110mA
    • 5V to 3.3V: Max available load current = 140mA
    • 3.3V to 3.3V: Max available load current = 60mA
  • Independent power supply for channel isolator & power converter
    • Logic supply (VIO): 1.71V to 5.5V
    • Power converter supply (VDD): 3V to 5.5V
  • Robust electromagnetic compatibility (EMC)
    • System-level ESD, EFT, and surge immunity
    • ±8kV IEC 61000-4-2 contact discharge protection across isolation barrier
  • High CMTI: 100kV/µs (typical)
  • Safety Related Certifications:
    • VDE reinforced insulation per DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 component recognition program
    • IEC 62368-1, IEC 61010-1, IEC 60601-1 and GB 4943.1 certifications
  • Extended temperature range: –40°C to +125°C
  • 20-pin wide body SOIC package