SLLSFX5 March   2026 TLIN821-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specification
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings - IEC Specification
    4. 5.4 Thermal Information
    5. 5.5 Recommended Operating Conditions
    6. 5.6 Power Supply Characteristics
    7. 5.7 Electrical Characteristics
    8. 5.8 AC Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  LIN
        1. 7.3.1.1 LIN Transmitter Characteristics
        2. 7.3.1.2 LIN Receiver Characteristics
          1. 7.3.1.2.1 Termination
      2. 7.3.2  TXD
      3. 7.3.3  RXD
      4. 7.3.4  VSUP
      5. 7.3.5  GND
      6. 7.3.6  EN
      7. 7.3.7  WAKE
      8. 7.3.8  INH
      9. 7.3.9  Local Faults
      10. 7.3.10 TXD Dominant Time-Out (DTO)
      11. 7.3.11 Bus Stuck Dominant System Fault: False Wake-Up Lockout
      12. 7.3.12 Thermal Shutdown
      13. 7.3.13 Under Voltage on VSUP
      14. 7.3.14 Unpowered Device
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 Wake-Up Events
        1. 7.4.4.1 Local Wake-Up (LWU) using the WAKE Input Terminal
        2. 7.4.4.2 Wake-Up Request (RXD)
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1 Normal Mode Application Note
        2. 8.2.2.2 TXD Dominant State Time-Out Application Note
        3. 8.2.2.3 Standby Mode Application Note
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 11.1 Tape and Reel Information
    3. 11.2 Mechanical Data

Abstract

PACKAGING INFORMATION

Orderable part number Status
(1)		 Material
type
(2)		 Package | Pins Package qty | Carrier RoHS
(3)		 Lead finish/Ball material
(4)		 MSL rating/Peak reflow
(5)		 Op temp (°C) Part marking
(6)
TLIN821Q1 Active Production SON (DRB) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 PTL821
 TLIN821Q1.A Active Production SON (DRB) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 PTL821
TLIN821Q1  Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 PTL821
TLIN821Q1.A  Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 PTL821
(1) Status: For more details on status, see our product life cycle.
(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.
(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.
Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.