SLLSFZ8A November   2025  – March 2026 MCF8329HS-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings Auto
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Characteristics of the SDA and SCL bus for Standard and Fast mode
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Three Phase BLDC Gate Drivers
      2. 6.3.2  Gate Drive Architecture
        1. 6.3.2.1 Dead time and Cross Conduction Prevention
      3. 6.3.3  AVDD Linear Voltage Regulator
      4. 6.3.4  Low-Side Current Sense Amplifier
      5. 6.3.5  Device Interface Modes
        1. 6.3.5.1 Interface - Control and Monitoring
        2. 6.3.5.2 I2C Interface
      6. 6.3.6  Motor Control Input Options
        1. 6.3.6.1 Analog-Mode Motor Control
        2. 6.3.6.2 PWM-Mode Motor Control
        3. 6.3.6.3 Frequency-Mode Motor Control
        4. 6.3.6.4 I2C based Motor Control
        5. 6.3.6.5 Input Control Signal Profiles
          1. 6.3.6.5.1 Linear Control Profiles
          2. 6.3.6.5.2 Staircase Control Profiles
          3. 6.3.6.5.3 Forward-Reverse Profiles
          4. 6.3.6.5.4 Multi-Reference Mode Operation
          5. 6.3.6.5.5 Input Reference Transfer Function without Profiler
      7. 6.3.7  Bootstrap Capacitor Initial Charging
      8. 6.3.8  Starting the Motor Under Different Initial Conditions
        1. 6.3.8.1 Case 1 – Motor is Stationary
        2. 6.3.8.2 Case 2 – Motor is Spinning in the Forward Direction
        3. 6.3.8.3 Case 3 – Motor is Spinning in the Reverse Direction
      9. 6.3.9  Motor Start Sequence (MSS)
        1. 6.3.9.1 Initial Speed Detect (ISD)
        2. 6.3.9.2 Motor Resynchronization
        3. 6.3.9.3 Reverse Drive
          1. 6.3.9.3.1 Reverse Drive Tuning
        4. 6.3.9.4 Motor Start-up
          1. 6.3.9.4.1 Align
          2. 6.3.9.4.2 Double Align
          3. 6.3.9.4.3 Initial Position Detection (IPD)
            1. 6.3.9.4.3.1 IPD Operation
            2. 6.3.9.4.3.2 IPD Release
            3. 6.3.9.4.3.3 IPD Advance Angle
          4. 6.3.9.4.4 Slow First Cycle Startup
          5. 6.3.9.4.5 Open Loop
          6. 6.3.9.4.6 Transition from Open to Closed Loop
      10. 6.3.10 Closed Loop Operation
        1. 6.3.10.1 Closed loop accelerate
        2. 6.3.10.2 Speed PI Control
        3. 6.3.10.3 Current PI Control
        4. 6.3.10.4 Overmodulation
        5. 6.3.10.5 Power Loop
        6. 6.3.10.6 Modulation Index Control
        7. 6.3.10.7 Motor Speed Limit
        8. 6.3.10.8 Input DC Power Limit
      11. 6.3.11 Maximum Torque Per Ampere (MTPA) Control
      12. 6.3.12 Flux Weakening Control
      13. 6.3.13 Motor Parameters
        1. 6.3.13.1 Motor Resistance
        2. 6.3.13.2 Motor Inductance
        3. 6.3.13.3 Motor Back-EMF constant
      14. 6.3.14 Motor Parameter Extraction Tool (MPET)
      15. 6.3.15 Single Hall Sensor Operation
      16. 6.3.16 Anti-Voltage Surge (AVS)
      17. 6.3.17 Active Braking
      18. 6.3.18 Output PWM Switching Frequency
      19. 6.3.19 PWM Dithering
      20. 6.3.20 Voltage Sense Scaling
      21. 6.3.21 Motor Stop Options
        1. 6.3.21.1 Coast (Hi-Z) Mode
        2. 6.3.21.2 Low-Side Braking
        3. 6.3.21.3 Active Spin-Down
      22. 6.3.22 FG Configuration
        1. 6.3.22.1 FG Output Frequency
        2. 6.3.22.2 FG in Open-Loop
        3. 6.3.22.3 FG During Motor Stop
        4. 6.3.22.4 FG Behavior During Fault
      23. 6.3.23 Protections
        1. 6.3.23.1  PVDD Supply Undervoltage Lockout (PVDD_UV)
        2. 6.3.23.2  AVDD Power on Reset (AVDD_POR)
        3. 6.3.23.3  GVDD Undervoltage Lockout (GVDD_UV)
        4. 6.3.23.4  BST Undervoltage Lockout (BST_UV)
        5. 6.3.23.5  MOSFET VDS Overcurrent Protection (VDS_OCP)
        6. 6.3.23.6  VSENSE Overcurrent Protection (SEN_OCP)
        7. 6.3.23.7  Thermal Shutdown (OTSD)
        8. 6.3.23.8  Hardware Lock Detection Current Limit (HW_LOCK_ILIMIT)
          1. 6.3.23.8.1 HW_LOCK_ILIMIT Latched Shutdown (HW_LOCK_ILIMIT_MODE = 00xb or 010b)
          2. 6.3.23.8.2 HW_LOCK_ILIMIT Automatic recovery (HW_LOCK_ILIMIT_MODE = 011b or 10xb)
          3. 6.3.23.8.3 HW_LOCK_ILIMIT Report Only (HW_LOCK_ILIMIT_MODE = 110b)
          4. 6.3.23.8.4 HW_LOCK_ILIMIT Disabled (HW_LOCK_ILIMIT_MODE = 111b)
        9. 6.3.23.9  Lock Detection Current Limit (LOCK_ILIMIT)
          1. 6.3.23.9.1 LOCK_ILIMIT Latched Shutdown (LOCK_ILIMIT_MODE = 00xb or 010b)
          2. 6.3.23.9.2 LOCK_ILIMIT Automatic Recovery (LOCK_ILIMIT_MODE = 011b or 10xb)
          3. 6.3.23.9.3 LOCK_ILIMIT Report Only (LOCK_ILIMIT_MODE = 110b)
          4. 6.3.23.9.4 LOCK_ILIMIT Disabled (LOCK_ILIMIT_MODE = 111b)
        10. 6.3.23.10 Motor Lock (MTR_LCK)
          1. 6.3.23.10.1 MTR_LCK Latched Shutdown (MTR_LCK_MODE = 00xb or 010b)
          2. 6.3.23.10.2 MTR_LCK Automatic Recovery (MTR_LCK_MODE = 011b or 10xb)
          3. 6.3.23.10.3 MTR_LCK Report Only (MTR_LCK_MODE = 110b)
          4. 6.3.23.10.4 MTR_LCK Disabled (MTR_LCK_MODE = 111b)
        11. 6.3.23.11 Motor Lock Detection
          1. 6.3.23.11.1 Lock 1: Abnormal Speed (ABN_SPEED)
          2. 6.3.23.11.2 Lock 2: Abnormal BEMF (ABN_BEMF)
          3. 6.3.23.11.3 Lock3: No-Motor Fault (NO_MTR)
        12. 6.3.23.12 EEPROM Fault
        13. 6.3.23.13 I2C CRC Fault
        14. 6.3.23.14 Maximum PVDD (Overvoltage) Protection
        15. 6.3.23.15 Minimum PVDD (Undervoltage) Protection
        16. 6.3.23.16 MPET Faults
        17. 6.3.23.17 Dry Run Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Functional Modes
        1. 6.4.1.1 Sleep Mode
        2. 6.4.1.2 Standby Mode
        3. 6.4.1.3 Fault Reset (CLR_FLT)
    5. 6.5 External Interface
      1. 6.5.1 DRVOFF - Gate Driver Shutdown Functionality
      2. 6.5.2 Oscillator Source
        1. 6.5.2.1 Clock (Internal Oscillator) Frequency
      3. 6.5.3 External Watchdog with MCU Reset
    6. 6.6 EEPROM access and I2C interface
      1. 6.6.1 EEPROM Access
        1. 6.6.1.1 EEPROM Write
        2. 6.6.1.2 EEPROM Read
        3. 6.6.1.3 EEPROM Security
      2. 6.6.2 I2C Serial Interface
        1. 6.6.2.1 I2C Data Word
        2. 6.6.2.2 I2C Write Transaction
        3. 6.6.2.3 I2C Read Transaction
        4. 6.6.2.4 Examples of I2C Communication Protocol Packets
        5. 6.6.2.5 I2C Clock Stretching
        6. 6.6.2.6 CRC Byte Calculation
  8. 7 EEPROM (Non-Volatile) Register Map
    1. 7.1 Algorithm_Configuration Registers
    2. 7.2 Fault_Configuration Registers
    3. 7.3 Hardware_Configuration Registers
    4. 7.4 Internal_Algorithm_Configuration Registers
  9. 8 RAM (Volatile) Register Map
    1. 8.1 Fault_Status Registers
    2. 8.2 System_Status Registers
    3. 8.3 Algorithm_Control Registers
    4. 8.4 Device_Control Registers
    5. 8.5 Algorithm_Variables Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1.      Detailed Design Procedure
      2.      Bootstrap Capacitor and GVDD Capacitor Selection
      3.      Gate Drive Current
      4.      Gate Resistor Selection
      5.      System Considerations in High Power Designs
      6.      Capacitor Voltage Ratings
      7.      External Power Stage Components
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Bulk Capacitance
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Thermal Considerations
        1. 9.4.3.1 Power Dissipation
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.3.2.1 Dead time and Cross Conduction Prevention

The MCF8329HS-Q1 provides digital dead time insertion between the high side and low side PWM signals, to prevent both external MOSFETs of each half-bridge from switching on at the same time. Digital dead time can be adjusted by configuring the EEPROM register DIG_DEAD_TIME.

The applied dead time depends on the internal clock frequency configured by CLOCK_FREQUENCY. Refer to Table 6-11 for more details.