SLLU376 December   2023

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Board Components and Pad Overview
    2. 2.2 Power Requirements
    3. 2.3 Default Operational Mode
    4. 2.4 Single Ended Bus (Controller Side) Modification Options
    5. 2.5 Differential Bus (RS-485) Modification Options
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5References

Bill of Materials (BOM)

Table 3-1 Bill of Materials
Manufacturer Part Number Designator Quantity

Keystone

5012

A1, B1, Y1, Z1

4

TDK

C2012X5R1A476M125AC

C2, C4

2

Samsung

CL21A106KQFNNNG

C3, C5

2

Kemet

C0603C104K9PAC7867

C6

1

TDK

C1608X7R1E104K080AA

C7, C8, C11, C12

4

Wurth Elektronik

150060RS75000

D1

1

Wurth Elektronik

150060GS75000

D2

1

Wurth Elektronik

150060BS75000

D3

1

B&F Fastener Supply

NY PMS 440 0025 PH

H1, H2, H3, H4

4

Keystone

1902C

H5, H6, H7, H8

4

Mill-Max

802-10-008-10-001000

J1, J2, J3, J4

4

Phoenix Contact

1725669

J5, J11, J14

3

Wurth Elektronik

61300411121

J6, J7, J8, J9, J10, J12, J13, J15, J16, J17

10

Brady

THT-14-423-10

LBL1

1

Vishay-Dale

RCS06030000Z0EA

R1, R4, R7, R10, R17, R18, R20, R21

8

Vishay-Dale

CRCW06031K00JNEA

R3, R13, R15

3

Panasonic

ERJ-P06J121V

R16, R19

2

Texas Instruments

THVD2412DRC

U1

1