SLOS451C December   2004  – March 2025 THS4631

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Transimpedance Fundamentals
      2. 8.1.2 Noise Analysis
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband Photodiode Transimpedance Amplifier
        1. 8.2.1.1 Detailed Design Procedure
          1. 8.2.1.1.1 Designing the Transimpedance Circuit
          2. 8.2.1.1.2 Measuring Transimpedance Bandwidth
          3. 8.2.1.1.3 Summary of Key Decisions in Transimpedance Design
          4. 8.2.1.1.4 Selection of Feedback Resistors
        2. 8.2.1.2 Application Curves
      2. 8.2.2 Alternative Transimpedance Configurations
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Slew-Rate Performance With Varying Input-Step Amplitude and Rise-and-Fall Time
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Printed-Circuit Board (PCB) Layout Techniques for High Performance
        2. 8.4.1.2 PowerPAD Design Considerations
        3. 8.4.1.3 PowerPAD PCB Layout Considerations
        4. 8.4.1.4 Power Dissipation and Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Design Tools Evaluation Fixture, Spice Models, and Applications Support
        1. 9.1.1.1 Bill of Materials
        2. 9.1.1.2 EVM
        3. 9.1.1.3 EVM Warnings and Restrictions
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) THS4631 UNIT
D (SOIC) DDA (HSOIC) DGN (HVSSOP)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 95 45.8 58.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 38.3 9.2 4.7 °C/W
RθJB Junction-to-board thermal resistance N/A N/A N/A °C/W
ΨJT Junction-to-top characterization parameter N/A N/A N/A °C/W
ΨJB Junction-to-board characterization parameter N/A N/A N/A °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.