The THS4631 is available in a thermally-enhanced PowerPAD integrated circuit family of packages. These packages are constructed using a downset leadframe upon which the die is mounted; see also Figure 8-12 (a) and (b). This arrangement results in the lead frame being exposed as a thermal pad on the underside of the package; see also Figure 8-12 (c). Because this thermal pad has direct thermal contact with the die, excellent thermal performance is achieved by providing a good thermal path away from the thermal pad.

The PowerPAD package allows for both assembly and thermal management in one manufacturing operation. During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be soldered to a copper area underneath the package. Through the use of thermal paths within this copper area, heat is conducted away from the package into either a ground plane or other heat dissipating device.

The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of surface mount with the mechanical methods of dissipating heat.

Figure 8-12 Views of Thermally Enhanced Package