SLOS451D December   2004  – March 2026 THS4631

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Transimpedance Fundamentals
      2. 8.1.2 Noise Analysis
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband Photodiode Transimpedance Amplifier
        1. 8.2.1.1 Detailed Design Procedure
          1. 8.2.1.1.1 Designing the Transimpedance Circuit
          2. 8.2.1.1.2 Measuring Transimpedance Bandwidth
          3. 8.2.1.1.3 Summary of Key Decisions in Transimpedance Design
          4. 8.2.1.1.4 Selection of Feedback Resistors
        2. 8.2.1.2 Application Curves
      2. 8.2.2 Alternative Transimpedance Configurations
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Slew-Rate Performance With Varying Input-Step Amplitude and Rise-and-Fall Time
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Printed-Circuit Board (PCB) Layout Techniques for High Performance
        2. 8.4.1.2 PowerPAD Design Considerations
        3. 8.4.1.3 PowerPAD PCB Layout Considerations
        4. 8.4.1.4 Power Dissipation and Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Design Tools Evaluation Fixture, Spice Models, and Applications Support
        1. 9.1.1.1 Bill of Materials
        2. 9.1.1.2 EVM
        3. 9.1.1.3 EVM Warnings and Restrictions
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

9.1.1.1 Bill of Materials

Table 9-1 THS4631DDA EVM Bill of Materials (BOM)
ITEM DESCRIPTION SMD SIZE REFERENCE
DESIGNATOR		 PCB
QUANTITY		 MANUFACTURER
PART NUMBER(1)
1 CAP, 2.2µF, CERAMIC, X5R, 25V 1206 C3, C6 2 (AVX) 12063D225KAT2A
4 CAP, 0.1µF, CERAMIC, X7R, 50V 0805 C1, C2 2 (AVX) 08055C104KAT2A
OPEN 0805 R4, Z4, Z6 3
6 RESISTOR, 0Ω, 1/8W 0805 Z2 1 (KOA) RK73Z2ATTD
7 RESISTOR, 499Ω, 1/8W, 1% 0805 R3, Z5 2 (KOA) RK73H2ATTD4990F
8 OPEN 1206 R8, Z9 2
9 RESISTOR, 0Ω, 1/4W 1206 R1 1 (KOA) RK73Z2BLTD
10 RESISTOR, 49.9Ω, 1/4W, 1% 1206 R2 1 (KOA) RK73H2BLTD49R9F
11 RESISTOR, 953Ω, 1/4W, 1% 1206 Z3 1 (KOA) RK73H2BLTD9530F
13 CONNECTOR, SMA PCB JACK J1, J2, J3 3 (JOHNSON) 142-0701-801
14 JACK, BANANA RECEPTANCE, 0.25" DIA. HOLE J4, J5, J6 3 (SPC) 813
15 TEST POINT, BLACK TP1, TP2 2 (KEYSTONE) 5001
TEST POINT, RED TP3 1 (KEYSTONE) 5000
16 STANDOFF, 4-40 HEX, 0.625" LENGTH 4 (KEYSTONE) 1808
17 SCREW, PHILLIPS, 4-40, .250" 4 SHR-0440-016-SN
18 IC, THS4631 U1 1 (TI) THS4631DDA
19 BOARD, PRINTED CIRCUIT 1 (TI) EDGE # 6467873 Rev.A
(1) The manufacturer's part numbers are used for test purposes only.