SLOS548A September   2007  – June 2026 TL082-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Electrical Characteristics
    4. 5.4 Operating Characteristics
    5. 5.5 Typical Characteristics
    6. 5.6 Old Versus New Die Comparison
  7. 6 Parameter Measurement Information
  8. 7 Application Information
    1. 7.1 Application Information Disclaimer
    2. 7.2 Application Information
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.6 Old Versus New Die Comparison

As of the publication of revision A of this datasheet, Texas Instruments has moved manufacturing of the die for TL082-Q1 to a modern fabrication site. The two different die are referred to in this document as “old” (previous fabrication site) and “new” die. The die origin can separate from the “Chip Source Origin” (CSO) parameter in the shipping information. The old die CSO is “SHE”, for the new die the CSO is “RFB”. The old die information is in the shipping information. The old die information is maintained in this datasheet for comparison purposes, but all new manufacturing has moved to the new die.