SLOSEE6 July   2026 OPA955

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input and ESD Protection
      2. 8.3.2 Feedback Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply and Single-Supply Operation
  10. 9 Application and Implementation
    1. 9.1 Power Supply Recommendations
    2. 9.2 Layout
      1. 9.2.1 Layout Guidelines
      2. 9.2.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

OPA955 DSG Package,8-Pin WSON With Exposed Thermal Pad(Top View)Figure 5-1 DSG Package,
8-Pin WSON With Exposed Thermal Pad
(Top View)
Table 5-1 Pin Functions
PINTYPEDESCRIPTION
NAMENO.
FB1InputFeedback connection to output of amplifier
IN–3InputInverting input
IN+4InputNoninverting input
NC2—Do not connect
OUT6OutputAmplifier output
PD8InputPower down connection. PD = logic low = power off mode; PD = logic high = normal operation.
VS–5—Negative voltage supply
VS+7—Positive voltage supply
Thermal pad—Connect the thermal pad to a heat-spreading power or ground plane.