SLOSEG2A April   2026  – June 2026 OPA2620 , OPA620

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information OPA620
    5. 6.5 Thermal Information OPA2620
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to- Rail Input
      3. 8.3.3 Rail-to- Rail Output
      4. 8.3.4 Output Drive
      5. 8.3.5 Capacitive Load and Stability
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Side Current Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 CPU/GPU Supply Voltage Monitoring
        1. 9.2.2.1 Detailed Design Procedure
      3. 9.2.3 Driving Analog-to-Digital Converters
        1. 9.2.3.1 Detailed Design Procedure
      4. 9.2.4 Wide-Band Transimpedance Amplifier
        1. 9.2.4.1 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Power Dissipation
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.4.1 Layout Guidelines

Employ good, high-frequency printed-circuit board (PCB) layout techniques for the OPAx620. Generous use of ground planes, short and direct signal traces, and an excellent choice of bypass capacitor located at the V+ pin provide clean, stable operation. Large areas of copper provides a means of dissipating heat that is generated in normal operation.

TI does not recommend using sockets with any high-speed amplifier.

A 10nF ceramic bypass capacitor is the minimum recommended value; adding a 1µF or larger tantalum capacitor in parallel is beneficial when driving a low-resistance load. Providing adequate bypass capacitance is essential to achieving low harmonic and inter-modulation distortion.