SLOSEG2A April   2026  – June 2026 OPA2620 , OPA620

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information OPA620
    5. 6.5 Thermal Information OPA2620
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to- Rail Input
      3. 8.3.3 Rail-to- Rail Output
      4. 8.3.4 Output Drive
      5. 8.3.5 Capacitive Load and Stability
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Side Current Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 CPU/GPU Supply Voltage Monitoring
        1. 9.2.2.1 Detailed Design Procedure
      3. 9.2.3 Driving Analog-to-Digital Converters
        1. 9.2.3.1 Detailed Design Procedure
      4. 9.2.4 Wide-Band Transimpedance Amplifier
        1. 9.2.4.1 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Power Dissipation
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Power Dissipation

Power dissipation depends on power-supply voltage, signal and load conditions. With dc signals, power dissipation is equal to the product of output current times the voltage across the conducting output transistor,
VS − VO. Power dissipation is minimized by using the lowest possible power-supply voltage necessary to provide the required output voltage swing.

For resistive loads, the maximum power dissipation occurs at a dc output voltage of one-half the power-supply voltage. Dissipation with ac signals is less. The Power Amplifier Stress and Power Handling Limitations application bulletin explains how to calculate or measure power dissipation with unusual signals and loads.

Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heat sink. For reliable operation, limit the maximum junction temperature to the value listed in Section 6.3. To estimate the margin of safety in a complete design, increase the ambient temperature until the thermal protection is triggered at 160°C. The thermal protection must trigger more than 35°C greater than the maximum expected ambient condition of the application.