SLOU588 March   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Device Information
  8. 2Hardware
    1. 2.1 Setup
      1. 2.1.1 General Use
      2. 2.1.2 Test Setup Diagrams
        1. 2.1.2.1 Gain and OP1dB Test Setup
        2. 2.1.2.2 S-Parameter Test Setup
        3. 2.1.2.3 Noise Figure Test Setup
        4. 2.1.2.4 Two-Tone OIP3 Test Setup
  9. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
      1. 3.2.1 Stack-Up and Material
    3. 3.3 Bill of Materials (BOM)
  10. 4Additional Information
    1.     Trademarks
  11. 5Related Documentation

3.2.1 Stack-Up and Material

The TRF1213EVM is a four-layer board whose material type is Rogers® 4350B. The top layer routes the power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground layer. The signal trace impedance is targeted at 50Ω. The bottom three layers are ground layers. Table 3-1 lists the EVM stack-up.

Table 3-1 TRF1213EVM Stack-Up
LayerNameMaterialThickness

(mils)

Dielectric Constant
Top Overlay
Top SolderSolder Resist1.003.5
1Top LayerCopper1.40

Dielectric 1

Rogers 4350B5.003.48
2GNDCopper1.40
Dielectric 2FR444.804.2
3PWRCopper1.40
Dielectric 3FR45.004.2
4Bottom LayerCopper1.40
Bottom SolderSolder Resist1.003.5
Bottom Overlay