SLPS271H March   2010  – December 2024 CSD17510Q5A

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Electrical Characteristics
  6. 5Thermal Characteristics
  7. 6Typical MOSFET Characteristics
  8. 7Device and Documentation Support
    1. 7.1 Third-Party Products Disclaimer
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Receiving Notification of Documentation Updates
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  9. 817
  10. 9Mechanical Data

5 Thermal Characteristics

(TA = 25°C unless otherwise stated)
PARAMETER MIN TYP MAX UNIT
RθJC Thermal Resistance Junction to Case(1) 1.6 °C/W
RθJA Thermal Resistance Junction to Ambient(1)(2) 51 °C/W
(1) RθJC is determined with the device mounted on a 1-inch2 (6.45cm2), 2oz. (0.071mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81cm × 3.81cm), 0.06-inch (1.52mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45cm2), 2oz. (0.071mm thick) Cu.

CSD17510Q5A
Max RθJA = 51°C/W when mounted on 1 inch2 (6.45cm2) of 2oz. (0.071mm thick) Cu.
CSD17510Q5A
Max RθJA = 125°C/W when mounted on a minimum pad area of 2-oz. (0.071-mm thick) Cu.