SLPS369C February   2012  – May 2025 CSD16342Q5A

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Characteristics
  6. 5Typical MOSFET Characteristics
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

4.2 Thermal Characteristics

(TA = 25°C unless otherwise stated)
PARAMETER MIN TYP MAX UNIT
RθJC Thermal Resistance Junction to Case(1) 1.2 °C/W
RθJA Thermal Resistance Junction to Ambient(1)(2) 50 °C/W
(1) RθJC is determined with the device mounted on a 1-inch2 (6.45cm2), 2oz. (0.071mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81cm × 3.81cm), 0.06-inch (1.52mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45cm2), 2oz. (0.071mm thick) Cu.

CSD16342Q5A
Max RθJA = 50°C/W when mounted on 1 inch2 of 2oz. Cu.
CSD16342Q5A
Max RθJA = 123°C/W when mounted on minimum pad area of 2oz. Cu.