SLPS816A January   2026  – June 2026 JFE2325

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High Input Impedance
      2. 6.3.2 Precision Matching
      3. 6.3.3 Electrostatic Discharge (ESD) Sensitivity
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Biasing Diode
    2. 7.2 Typical Applications
      1. 7.2.1 Common-Source Amplifier for Electret Condenser Microphones
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 System Examples
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 8.1.1.3 TI Reference Designs
        4. 8.1.1.4 Filter Design Tool
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

6.3.3 Electrostatic Discharge (ESD) Sensitivity

Electrostatic discharge can damage this device, even at seemingly harmless voltage levels. ESD protective measures are required during handling and assembly of the device on a PCB. Use grounded wrist straps, work on grounded surfaces, and store the device in conductive packaging; working in an ESD protected area (EPA) is also recommended. Ignoring proper ESD precautions can cause latent damage, resulting in immediate or intermittent device failure. TI strongly recommends adhering to industry standard ESD handling procedures during all handling, assembly, and testing stages.