It is very important to establish a clean grounding scheme to ensure best performance of the device. There is one ground pin (GND) on the device. It is a good practice to use top and bottom PCB layers for signal routing, and use middle layers as ground planes. Even on a PCB layer that is mainly for signal routing, it is good practice to have a small island of ground pour if possible to provide a low-impedance ground, rather than simply a via through the ground trace to an lower ground plane. Create a keep-out area (no other traces and no ground plane) around the daisy chain components in all PCB layers.

There is a strong recommendation to have a minimum of four layers in the PCB, with one layer fully dedicated to an unbroken VSS plane (except thermal reliefs). Avoid placing tracks on this layer to maintain the unbroken integrity of the plane structure.