SLUAA61B September   2022  – November 2022 UCC27282-Q1 , UCC27284-Q1

 

  1. 1Functional Safety FIT Rate, FMD and Pin FMA
    1. 1.1 Overview
    2. 1.2 Functional Safety Failure In Time (FIT) Rates
      1. 1.2.1 SOIC Package
        1. 1.2.1.1 Failure Mode Distribution (FMD)
      2. 1.2.2 VSON Package
        1. 1.2.2.1 Failure Mode Distribution (FMD)
    3. 1.3 Pin Failure Mode Analysis (Pin FMA)
      1. 1.3.1 SOIC Package
      2. 1.3.2 VSON Package
  2. 2Revision History

1.2.2 VSON Package

This section provides Functional Safety Failure In Time (FIT) rates for the VSON package of UCC27282-Q1 based on two different industry-wide used reliability standards:

  • Component Failure Rates per IEC TR 62380 / ISO 26262 Part 1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Component Failure Rates per Siemens Norm SN 29500-2 provides FIT rates based on the Siemens Norm SN 29500-2
Table 1-4 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours)
Total Component FIT Rate (Power dissipation:10 mW,100mW, 500mW) 10,12,25
Die FIT Rate (Power dissipation:10 mW,100mW, 500mW) 2,3,14
Package FIT Rate (Power dissipation:10 mW,100mW, 500mW) 8,9,11

The failure rate and mission profile information in Component Failure Rates per IEC TR 62380 / ISO 26262 Part 1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 10 mW,100mW, 500mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT

Table 1-5 Component Failure Rates per Siemens Norm SN 29500-2
Table Category Reference FIT Rate Reference Virtual TJ
5 CMOS, BICMOS,
Digital, analog /mixed		 20 FIT 55°C