SLUSCS3L October   2017  – March 2025 BQ2980 , BQ2982

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Device Configurability
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overvoltage (OV) Status
      2. 7.3.2 Undervoltage (UV) Status
      3. 7.3.3 Overcurrent in Charge (OCC) Status
      4. 7.3.4 Overcurrent in Discharge (OCD) and Short Circuit in Discharge (SCD) Status
      5. 7.3.5 Overtemperature (OT) Status
      6. 7.3.6 Charge and Discharge Driver
      7. 7.3.7 CTR for FET Override and Device Shutdown
      8. 7.3.8 CTR for PTC Connection
      9. 7.3.9 ZVCHG (0V Charging)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
        1. 7.4.1.1 Power-On-Reset (POR)
        2. 7.4.1.2 NORMAL Mode
        3. 7.4.1.3 FAULT Mode
        4. 7.4.1.4 SHUTDOWN Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Test Circuits for Device Evaluation
      2. 8.1.2 Test Circuit Diagrams
      3. 8.1.3 Using CTR as FET Driver On/Off Control
    2. 8.2 Typical Applications
      1. 8.2.1 BQ298xx Configuration 1: System-Controlled Reset/Shutdown Function
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Selection of Power FET
        4. 8.2.1.4 Application Curves
      2. 8.2.2 BQ298xx Configuration 2: CTR Function Disabled
      3. 8.2.3 BQ298xx Configuration 3: PTC Thermistor Protection
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) BQ2980xx/BQ2982xx UNIT
RUG (X2QFN)
8 PINS
RθJA Junction-to-ambient thermal resistance 171.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75 °C/W
RθJB Junction-to-board thermal resistance 94.7 °C/W
ψJT Junction-to-top characterization parameter 2.5 °C/W
ψJB Junction-to-board characterization parameter 94.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.