SLUSFN2B May   2024  – December 2024 TPS513885

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  PWM Operation and D-CAP3™ Control Mode
      2. 6.3.2  VCC Switchover Function
      3. 6.3.3  Soft Start
      4. 6.3.4  Large Duty Operation
      5. 6.3.5  Power Good
      6. 6.3.6  Overcurrent Protection and Undervoltage Protection
      7. 6.3.7  Overvoltage Protection
      8. 6.3.8  UVLO Protection
      9. 6.3.9  Output Voltage Discharge
      10. 6.3.10 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Light Load Operation
      2. 6.4.2 Advanced Eco-mode Control
      3. 6.4.3 Out-of-Audio™ Mode
      4. 6.4.4 Mode Selection
      5. 6.4.5 Standby Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 External Component Selection
          1. 7.2.2.2.1 VOUT and FB Pin Configuration
          2. 7.2.2.2.2 MODE Selection
          3. 7.2.2.2.3 Inductor Selection
          4. 7.2.2.2.4 Output Capacitor Selection
          5. 7.2.2.2.5 Input Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPS513885 UNIT
VAB (VQFN)
13 PINS
RθJA Junction-to-ambient thermal resistance 53.8 °C/W
RθJA_effective Junction-to-ambient thermal resistance (4-layer custom board)(2) 26.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.9 °C/W
RθJB Junction-to-board thermal resistance 11.5 °C/W
ψJT Junction-to-top characterization parameter 2.4 °C/W
ψJB Junction-to-board characterization parameter 11.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) The effective RθJA is simulated based on TPS513885EVM.