SLUUCU2A March 2023 – September 2023 UCC14130-Q1 , UCC14131-Q1
The UCC14131EVM-070 is designed using a four-layer, FR4, PCB, fabricated with 2-ounce copper on all four layers. The EVM, PCB demonstrates the important use of ground planes and tented stitching vias for shielding and improving EMI performance. For higher density PCBs such as automotive traction inverters, the PCB can include several additional signal layers but similar design methodology can be applied as best as possible.
Figure 6-1 UCC14131EVM-070, Fully
Assembled 3D Top View
Figure 6-2 UCC14131EVM-070, Fully
Assembled 3D Bottom View
Figure 6-3 UCC14131EVM-070, 3D Angle
View
Figure 6-4 UCC14131EVM-070, PCB Top
Layer, Assembly
Figure 6-5 UCC14131EVM-070, GND Layer 2
(same as layer 3)
Figure 6-6 UCC14131EVM-070, GND Layer 3
(same as layer 2)
Figure 6-7 UCC14131EVM-070, PCB Bottom
Layer, Assembly (mirrored view)