SLUUD07B June   2024  – June 2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 I/O Descriptions
    2. 2.2 Printed Circuit Board Assembly
    3. 2.3 Best Practices
      1.      15
    4. 2.4 Test Summary
      1. 2.4.1 Equipment
      2. 2.4.2 Cautions
      3. 2.4.3 Test Instructions
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5Related Documentation
  11. 6Revision History

2.4.2 Cautions

Device can get hot during high output current conditions, use caution when handling the board.