SLUUD90 March   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
      3. 2.1.3 Recommended Test Setup
        1. 2.1.3.1 Input Connections
        2. 2.1.3.2 Output connections
      4. 2.1.4 Test Procedure
        1. 2.1.4.1 Line and Load Regulation, Efficiency
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials
  9. 4Compliance Information
    1. 4.1 Compliance and Certifications
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Related Documentation

3.2 PCB Layout

The following figures show the design of the TPS543521EVM using a four-layer PCB with 2oz copper thickness.

TPS543521EVM Top Copper (Top View)Figure 3-2 Top Copper (Top View)
TPS543521EVM Layer 3 Copper (Top View)Figure 3-4 Layer 3 Copper (Top View)
TPS543521EVM Layer 2 Copper (Top View)Figure 3-3 Layer 2 Copper (Top View)
TPS543521EVM Bottom Copper (Top View)Figure 3-5 Bottom Copper (Top View)