SLUUD91 March   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
      3. 2.1.3 Recommended Test Setup
        1. 2.1.3.1 Input Connections
        2. 2.1.3.2 Output connections
      4. 2.1.4 Test Procedure
        1. 2.1.4.1 Line and Load Regulation, Efficiency
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials
  9. 4Compliance Information
    1. 4.1 Compliance and Certifications
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Related Documentation

3.2 PCB Layout

Figure 3-2 through Figure 3-5 show the design of the TPSM843521EVM using a four-layer PCB with 2oz copper thickness.

TPSM843521EVM Top Copper (Top View)Figure 3-2 Top Copper (Top View)
TPSM843521EVM Layer 3 Copper (Top View)Figure 3-4 Layer 3 Copper (Top View)
TPSM843521EVM Layer 2 Copper (Top View)Figure 3-3 Layer 2 Copper (Top View)
TPSM843521EVM Bottom Copper (Top View)Figure 3-5 Bottom Copper (Top View)