SLUUD99A February   2025  – April 2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specifications
      1. 1.3.1 Recommended Operating Conditions
      2. 1.3.2 PCB and Mechanical Parameters
    4. 1.4 Device Information
    5. 1.5 General Texas Instruments High Voltage Evaluation (TI HV EMV) User Safety Guidelines
      1. 1.5.1 General Safety Information
  7. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Equipment
    3. 2.3 Setup
    4. 2.4 Header Information
    5. 2.5 Jumper Information
  8. 3Software
    1. 3.1 Communication Interface Installation
      1. 3.1.1 BQSTUDIO using EV2400
      2. 3.1.2 TI Charger GUI for USB2ANY
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Revision History

1.3.2 PCB and Mechanical Parameters

Table 1-2 PCB and Mechanical Parameters for the BQ25858EVM and the BQ25858BEVM
ValueUnit
Board size (X dimension, or length)112mm
Board size (Y dimension, or width)84mm
IC + power stage max height5mm
Total copper layers6layer
Copper weight per layer2oz
Total board thickness62mil