SLVA745A December   2015  – April 2025 TPS7B4253-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DDA 8-pin SO PowerPAD Package
    2. 2.2 PWP 20-pin HTSSOP (with exposed thermal pad) Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Modes and Effects Analysis (Pin FMEA)
    1. 4.1 DDA 8-pin SO PowerPAD Package
    2. 4.2 PWP 20-pin HTSSOP (with exposed thermal pad) Package
  7. 5Revision History

1 Overview

This document contains information for the TPS7B4253-Q1 (DDA 8-pin SO PowerPAD™ and PWP 20-pin HTSSOP (with exposed thermal pad) integrated circuit packages) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure modes and effects analysis (pin FMEA)

Figure 1-1 shows the device functional block diagram for reference.

TPS7B4253-Q1 Functional Block Diagram Figure 1-1 Functional Block Diagram

The TPS7B4253-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.