SLVA745A December   2015  – April 2025 TPS7B4253-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DDA 8-pin SO PowerPAD Package
    2. 2.2 PWP 20-pin HTSSOP (with exposed thermal pad) Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Modes and Effects Analysis (Pin FMEA)
    1. 4.1 DDA 8-pin SO PowerPAD Package
    2. 4.2 PWP 20-pin HTSSOP (with exposed thermal pad) Package
  7. 5Revision History

Pin Failure Modes and Effects Analysis (Pin FMEA)

This section provides a failure modes and effects analysis (pin FMEA) for the pins of the TPS7B4253-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-9 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
Class Failure Effects
A Potential device damage that affects functionality.
B No device damage, but loss of functionality.
C No device damage, but performance degradation.
D No device damage, no impact to functionality or performance.

Following are the assumptions of use and the device configuration assumed for the pin FMEA in this section:

  • Device operates at free-air temperatures between –40°C and 150°C.
  • The ADJ and EN pins are driven from external sources.
  • Device operates at an input voltage of at least 4V and no more than 40V.
  • Device operates according to all recommended operating conditions and the absolute maximum ratings in the device data sheet are not exceeded.