SLVA745A December   2015  – April 2025 TPS7B4253-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DDA 8-pin SO PowerPAD Package
    2. 2.2 PWP 20-pin HTSSOP (with exposed thermal pad) Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Modes and Effects Analysis (Pin FMEA)
    1. 4.1 DDA 8-pin SO PowerPAD Package
    2. 4.2 PWP 20-pin HTSSOP (with exposed thermal pad) Package
  7. 5Revision History

2.2 PWP 20-pin HTSSOP (with exposed thermal pad) Package

This section provides functional safety failure in time (FIT) rates for the PWP 20-pin HTSSOP (with exposed thermal pad) package of the TPS7B4253-Q1 based on two different industry-wide used reliability standards:

  • Table 2-3 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-4 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-3 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours)
Total component FIT rate 21
Die FIT rate 5
Package FIT rate 16

The failure rate and mission profile information in Table 2-3 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission profile: motor control from table 11 or figure 16
  • Power dissipation: 500mW
  • Climate type: world-wide table 8 or figure 13
  • Package factor (lambda 3): table 17b or figure 15
  • Substrate material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-4 Component Failure Rates per Siemens Norm SN 29500-2
Table Category Reference FIT Rate Reference Virtual TJ
4 Power Amplifier and Regulator ≤ 1Watt - (LDO) 40 FIT 70°C

The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-4 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.