The flowchart in Figure 3-2 shows end-to-end product manufacturing. After wafer fabrication, the die goes through a series of steps during packaging. Die dimensions and choice of material for die mount and package mold can affect device performance. Afterwards, each unit goes through x-ray inspection and functional electrical test and screened to adhere to the datasheet specifications and TI quality standards. After the test, devices are packed in a reel and shipped out. There may be a series of reliability stress tests usually during initial device release and subsequent changes to ensure that the product can reliably operate throughout the projected lifetime. The nature and severity of reliability is tied to the class of product and intended market, for example, automotive grade 0, commercial, or industrial equipment.

Texas Instruments has in-house end-to-end manufacturing capability including wafer manufacturing, assembly and packaging, physical and electrical screening, and reliability testing. With customer requirements as a central driving force, TI also provides geopolitical multi-sourcing for our products. Additionally, TI strives to periodically improve its manufacturing operations for performance improvement and cost reduction towards perpetual benefits for its customers.