10 Revision History
Changes from Revision I (September 2016) to Revision J (September 2026)
- Updated the numbering format for tables, figures, and
cross-references throughout the documentGo
- Updated output transistor description and symbols from BJT to MOSFET
throughout the documentGo
- Removed PDIP (16) packageGo
- Updated values in the Thermal Information table for all
packagesGo
- Changed output regulation typical value from 14mV to
6mVGo
- Changed open-loop voltage amplification typical value from 95dB to
80dBGo
- Changed common-mode rejection ratio typical value from 80dB to
100dBGo
- Changed input bias current (DEAD-TIME CTRL) typical value from -2μA
to -0.006μAGo
- Changed input threshold voltage (DEAD-TIME CTRL) typical value from
3V to 2.5VGo
- Changed output C1, C2 off-state current typical value from 2μA to
4μA, and 4μA to 2μA for other test condition Go
- Changed output C1E1, C2E2 saturation voltage in common source
configuration typical value from 1.1V to 0.5VGo
- Changed output C1E1, C2E2 saturation voltage in source follower
configuration typical value from 1.5V to 1.65VGo
- Changed input threshold voltage (FEEDBACK) typical value from 4V to
3.4VGo
- Changed standby supply current for VCC = 15V typical value from 9mA
to 1.62mAGo
- Changed standby supply current for VCC = 40V typical value from 11mA
to 1.68mA Go
- Changed average supply current typical value from 12.4mA to
2.2mAGo
- Changed rise time in common source configuration typical value from
100ns to 70nsGo
- Changed fall time in common source configuration typical value from
30ns to 20nsGo
- Changed rise time in source follower configuration typical value
from 200ns to 85nsGo
- Changed fall time in source follower configuration typical value
from 45ns to 35nsGo
- Updated Figure 5-1 and Amplifier Voltage Amplification vs Frequency
Go
- Updated description to align VREF
behavior changes for input voltages less than
7VGo
- Updated the formatting for inductor calculationsGo
- Updated reference voltage vs input voltage application curve Go
Changes from Revision H (January 2014) to Revision I (September 2016)
- Added Applications section, ESD Ratings table,
Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply
Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and
Orderable Information sectionGo
- Changed values in the Thermal Information table from 73 to
73.5 (D), from 67 to 43.5 (N), from 64 to 73.6 (NS), and from 108 to 101.5
(PW)Go