SLVS062O December   1991  – October 2025 TL1431 , TL1431M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings – TL1431C, TL1431Q
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics – TL1431C
    6. 5.6 Electrical Characteristics – TL1431Q
    7. 5.7 Electrical Characteristics – TL1431M
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Open Loop (Comparator)
      2. 7.4.2 Closed Loop
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Programming Output/Cathode Voltage
        2. 8.2.2.2 Total Accuracy
        3. 8.2.2.3 Stability
        4. 8.2.2.4 Start-up Time
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)TL1431TL1431M(2)UNIT
LP
(TO-92)		D
(SOIC)		PW
(TSSOP)		JG
(CDIP)		FK
(LCCC)
3 PINS8 PINS8 PINS8 PINS20 PINS
RθJAJunction-to-ambient thermal resistance157114.7172.4——°C/W
RθJC(top)Junction-to-case (top) thermal resistance80.75955.269.755.5°C/W
RθJBJunction-to-board thermal resistance—55.4100.89954.2°C/W
ψJTJunction-to-top characterization parameter24.6125——°C/W
ψJBJunction-to-board characterization parameter136.454.899——°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance———219.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) RθJC based on MIL-STD-883, and RθJB based on JESD51.