SLVSAI3D September   2010  – May 2025 TPS736-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Internal Current Limit
      2. 6.3.2 Transient Response
      3. 6.3.3 Reverse Current
      4. 6.3.4 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Enable Pin and Shutdown
      2. 6.4.2 Dropout Voltage
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Application Circuit for Fixed-Voltage Versions
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Input And Output Capacitor Requirements
          2. 7.2.1.2.2 Output Noise
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Typical Application Circuit for Adjustable-Voltage Version
        1. 7.2.2.1 Design Requirements
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Thermal Considerations
      2. 7.4.2 Layout Examples
  9. 8 Device And Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, And Orderable Information

7.4.1.1 Thermal Considerations

The ability to remove heat from the die is different for each package type, presenting different considerations in the PCB layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Performance data for JEDEC low- and high-K boards are shown in the Section 5.4 table. Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-holes to heat-dissipating layers also improve the heat sink effectiveness.

Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of the output current times the voltage drop across the output pass element (VIN to VOUT), shown in Equation 6:

Equation 6. TPS736-Q1

Power dissipation can be minimized by using the lowest possible input voltage necessary to provide the required output voltage.