SLVSGH7C November   2022  – May 2024 DRV8410

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
  8. 7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 External Components
    4. 8.4 Feature Description
      1. 8.4.1 Bridge Control
        1. 8.4.1.1 Parallel Bridge Interface
      2. 8.4.2 Current Regulation
      3. 8.4.3 Protection Circuits
        1. 8.4.3.1 Overcurrent Protection (OCP)
        2. 8.4.3.2 Thermal Shutdown (TSD)
        3. 8.4.3.3 Undervoltage Lockout (UVLO)
    5. 8.5 Device Functional Modes
      1. 8.5.1 Active Mode
      2. 8.5.2 Low-Power Sleep Mode
      3. 8.5.3 Fault Mode
    6. 8.6 Pin Diagrams
      1. 8.6.1 Logic-Level Inputs
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Typical Application
        1. 9.1.1.1 Stepper Motor Application
          1. 9.1.1.1.1 Design Requirements
          2. 9.1.1.1.2 Detailed Design Procedure
            1. 9.1.1.1.2.1 Stepper Motor Speed
            2. 9.1.1.1.2.2 Current Regulation
            3. 9.1.1.1.2.3 Stepping Modes
              1. 9.1.1.1.2.3.1 Full-Stepping Operation
              2. 9.1.1.1.2.3.2 Half-Stepping Operation with Fast Decay
              3. 9.1.1.1.2.3.3 Half-Stepping Operation with Slow Decay
          3. 9.1.1.1.3 Application Curves
        2. 9.1.1.2 Dual BDC Motor Application
          1. 9.1.1.2.1 Design Requirements
          2. 9.1.1.2.2 Detailed Design Procedure
            1. 9.1.1.2.2.1 Motor Voltage
            2. 9.1.1.2.2.2 Current Regulation
            3. 9.1.1.2.2.3 Sense Resistor
          3. 9.1.1.2.3 Application Curves
        3. 9.1.1.3 Thermal Considerations
          1. 9.1.1.3.1 Maximum Output Current
          2. 9.1.1.3.2 Power Dissipation
          3. 9.1.1.3.3 Thermal Performance
            1. 9.1.1.3.3.1 Steady-State Thermal Performance
            2. 9.1.1.3.3.2 Transient Thermal Performance
        4. 9.1.1.4 Multi-Sourcing with Standard Motor Driver Pinout
    2. 9.2 Power Supply Recommendations
      1. 9.2.1 Bulk Capacitance
      2. 9.2.2 Power Supply and Logic Sequencing
    3. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) DEVICE DEVICE UNIT
PWP (HTSSOP) RTE (WQFN)
PINS PINS
RθJA Junction-to-ambient thermal resistance 48.3 55 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47.8 56.7 °C/W
RθJB Junction-to-board thermal resistance 23.3 28.8 °C/W
ΨJT Junction-to-top characterization parameter 3.7 2.7 °C/W
ΨJB Junction-to-board characterization parameter 23.3 28.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.5 15.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.