SLVSHL6A June   2025  – December 2025 TPSI2260-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Avalanche Robustness
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Dielectric Withstand Testing (HiPot)
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure - Chassis Ground Reference
      4. 9.2.4 Application Performance Plot
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

TPSI2260-Q1 TPSI2260-Q1 DWQ Package,11-Pin SOIC(Top View)Figure 5-1 TPSI2260-Q1 DWQ Package,11-Pin SOIC(Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 VDD P Power supply for primary side
2 GND GND Ground supply for primary side
3 EN I Active high switch enable signal
4 NC/GND NC/GND Internally connected, connect externally to ground or leave floating
5 NC/GND NC/GND Internally connected, connect externally to ground or leave floating
6 NC/GND NC/GND Internally connected, connect externally to ground or leave floating
7 NC/GND NC/GND Internally connected, connect externally to ground or leave floating
8 GND GND Internally connected to GND, connect externally to ground or leave floating
9 S2 I/O Switch input
10 SM NC For thermal dissipation only, see Layout Guidelines for more information.
11 S1 I/O Switch input
(1) P = power, I = input, O = output, GND = ground, NC = no connect