SLVSI15A March   2025  – December 2025 TPSM8287B15 , TPSM8287B30

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency DCS-Control Topology
      2. 7.3.2  Forced PWM and Power Save Modes
      3. 7.3.3  Precise Enable
      4. 7.3.4  Start-Up
      5. 7.3.5  Output Voltage Setting
        1. 7.3.5.1 Output Voltage Setpoint
        2. 7.3.5.2 Output Voltage Range
        3. 7.3.5.3 Non-Default Output Voltage Setpoint
        4. 7.3.5.4 Dynamic Voltage Scaling (DVS)
        5. 7.3.5.5 Droop Compensation
      6. 7.3.6  Compensation (COMP)
      7. 7.3.7  Mode Selection / Clock Synchronization (MODE/SYNC)
      8. 7.3.8  Spread Spectrum Clocking (SSC)
      9. 7.3.9  Output Discharge
      10. 7.3.10 Undervoltage Lockout (UVLO)
      11. 7.3.11 Overvoltage Lockout (OVLO)
      12. 7.3.12 Overcurrent Protection
        1. 7.3.12.1 Cycle-by-Cycle Current Limiting
        2. 7.3.12.2 Hiccup Mode
        3. 7.3.12.3 Current-Limit Mode
      13. 7.3.13 Power Good (PG)
        1. 7.3.13.1 Power-Good Standalone, Primary Device Behavior
        2. 7.3.13.2 Power-Good Secondary Device Behavior
      14. 7.3.14 Remote Sense
      15. 7.3.15 Thermal Warning and Shutdown
      16. 7.3.16 Stacked Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset (POR)
      2. 7.4.2 Undervoltage Lockout
      3. 7.4.3 Standby
      4. 7.4.4 On
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 7.5.3 I2C HS-Mode Protocol
      4. 7.5.4 I2C Update Sequence
      5. 7.5.5 I2C Register Reset
  9. 8 Device Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting the Input Capacitors
        2. 9.2.2.2 Selecting the Target Loop Bandwidth
        3. 9.2.2.3 Selecting the Compensation Resistor
        4. 9.2.2.4 Selecting the Output Capacitors
        5. 9.2.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.2.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application Using Two TPSM8287B30x in Parallel Operation
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Selecting the Input Capacitors
        2. 9.3.2.2 Selecting the Target Loop Bandwidth
        3. 9.3.2.3 Selecting the Compensation Resistor
        4. 9.3.2.4 Selecting the Output Capacitors
        5. 9.3.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.3.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
        1. 9.5.2.1 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.5.1 Layout Guidelines

A proper layout is critical for the operation of any switched mode power supply, especially at high switching frequencies. Therefore, the PCB layout of the TPSM8287Bxx demands careful attention to make sure of best performance. A poor layout can lead to issues like the following:

  • Bad line and load regulation
  • Instability
  • Increased EMI radiation
  • Noise sensitivity

Refer to the Five Steps to a Great PCB Layout for a Step-Down Converter analog design journal for a detailed discussion of general best practices. The following are specific recommendations for the TPSM8287Bxx:

  • Place the input capacitors as close as possible to the VIN and PGND pins of the device. This placement is the most critical component placement. Route the input capacitors directly to the VIN and PGND pins avoiding vias.
  • Place the output capacitors close to the VOUT and PGND pins and route them directly avoiding vias.
  • Place the IC close to the load to minimize the power loss from voltage drop on the output and to minimize parasitic inductance between the output capacitors at the TPSM8287Bxx and those at the load.
  • Use vias under the exposed thermal pads to improve thermal performance. Directly connect the PGND pins to the exposed thermal pad with copper on the top PCB layer.
  • Route the VOSNS and GOSNS remote sense lines as a differential pair and connect them to the lowest impedance point at the load. Do not route the VOSNS and GOSNS traces close to any switch nodes, the input capacitors, clock signals, or other aggressor signals.
  • Connect the compensation components between COMP and AGND. Do not connect the compensation components directly to power ground.
  • Place the VSETx resistors (and SYNC_OUT resistor in the secondary devices) close to the TPSM8287Bxx to minimize parasitic capacitance.
  • In the stacked configuration, route COMP directly to keep COMP short and avoid noisy aggressor signals.
  • Refer to Figure 9-47 for an example of component placement, routing, and thermal design.