SLVSIP6 June   2026 LMK6L-Q1

ADVMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bulk Acoustic Wave (BAW)
      2. 8.3.2 Device Block-Level Description
      3. 8.3.3 Function Pins
        1. 8.3.3.1 FSEL Implementation
      4. 8.3.4 Output Terminations
        1. 8.3.4.1 Replacing a LVPECL oscillator with the LMK6L-Q1
        2. 8.3.4.2 Replacing a HCSL OSC With the LMK6L-Q1
      5. 8.3.5 Wettable Flanks
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 LVDS Phase Noise Curves
        2. 9.2.3.2 HS-LVDS 1.2Vppd Phase Noise Curves
        3. 9.2.3.3 AC-LVPECL 1.2Vppd Phase Noise Curves
        4. 9.2.3.4 LP-HCSL Phase Noise Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Providing Thermal Reliability
        2. 9.4.1.2 Recommended Solder Reflow Profile
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

9.4.1.1 Providing Thermal Reliability

The LMK6L-Q1 is a high-performance device. Therefore, pay careful attention to device configuration and printed circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the ground plane of the PCB through three vias or more to maximize thermal dissipation out of the package.

Equation 1 describes the relationship between the PCB temperature around the LMK6L-Q1 and the junction temperature.

Equation 1. T B   =   T J   -   Ψ J B   ×   P

where

  • TB: PCB temperature around the LMK6L-Q1
  • TJ: Junction temperature of LMK6L-Q1
  • ΨJB: Junction-to-board thermal resistance parameter of LMK6L-Q1 (refer to the Thermal Information tables in the Specifications section for this information)
  • P: On-chip power dissipation of LMK6L-Q1