SLVSIP6 June   2026 LMK6L-Q1

ADVMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bulk Acoustic Wave (BAW)
      2. 8.3.2 Device Block-Level Description
      3. 8.3.3 Function Pins
        1. 8.3.3.1 FSEL Implementation
      4. 8.3.4 Output Terminations
        1. 8.3.4.1 Replacing a LVPECL oscillator with the LMK6L-Q1
        2. 8.3.4.2 Replacing a HCSL OSC With the LMK6L-Q1
      5. 8.3.5 Wettable Flanks
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 LVDS Phase Noise Curves
        2. 9.2.3.2 HS-LVDS 1.2Vppd Phase Noise Curves
        3. 9.2.3.3 AC-LVPECL 1.2Vppd Phase Noise Curves
        4. 9.2.3.4 LP-HCSL Phase Noise Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Providing Thermal Reliability
        2. 9.4.1.2 Recommended Solder Reflow Profile
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Device Supply Voltage(1) 2.375 2.5, 3.3 3.465 V
TA Ambient temperature –40 105 °C
TPCB PCB temperature (measured below package) –40 105 °C
TJ Junction temperature –40 125 °C
tRAMP VDD power-up ramp time(1)(2) 0.1 100 ms