SLVSIS7 October   2026 OPA2986

ADVMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for OPA986
    5. 5.5 Thermal Information for OPA2986
    6. 5.6 Thermal Information for OPA4986
    7. 5.7 Electrical Characteristics for VS = 8V to 48V
    8. 5.8 Electrical Characteristics for VS = 4.5V to 8V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Mux-Friendly Inputs
      2. 6.3.2 Thermal Protection
      3. 6.3.3 Overload Recovery
      4. 6.3.4 Slew Rate
      5. 6.3.5 Full-Power Bandwidth Improved
      6. 6.3.6 e-Trim
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 2nd Order Low Pass Filter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 High-Side Current Sense
      3. 7.2.3 MDAC Output Gain and Buffer
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.6 Thermal Information for OPA4986

THERMAL METRIC(1) OPA4986 UNIT
D (SOIC) PW (TSSOP)
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 86.4 33.0 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 46.3 25.1 °C/W
RθJB Junction-to-board thermal resistance 41.0 11.6 °C/W
ψJT Junction-to-top characterization parameter 11.3 0.2 °C/W
ψJB Junction-to-board characterization parameter 40.7 11.5 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A 2.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.