SLVSJ70 December   2025 TRF0213-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Single-Ended to Differential Amplifier
      2. 6.3.2 Single Supply Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving a High-Speed ADC
      2. 7.1.2 Calculating Output Voltage Swing
      3. 7.1.3 Thermal Considerations
    2. 7.2 Typical Applications
      1. 7.2.1 TRF0213-SEP in Receive Chain
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Support Resources
    2. 8.2 Device Support
      1. 8.2.1 Third-Party Products Disclaimer
    3. 8.3 Documentation Support
      1. 8.3.1 Related Documentation
    4. 8.4 Receiving Notification of Documentation Updates
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

Figure 4-1 RPV Package,
12-Pin WQFN-FCRLF
(Top View)
Table 4-1 Pin Functions
PINTYPEDESCRIPTION
NAMENO.
GND1, 3, 4, 7, 8, 10GroundGround
INM5InputExternal ac coupling capacitor on negative input.
Typical value 100nF.
INP6InputSingle ended input
OUTM 12OutputDifferential signal output, negative
OUTP11OutputDifferential signal output, positive
PD2InputPower-down signal. Supports 1.8V and 3.3V Logic.
0 = Chip enabled
1 = Power down
VDD9Power5V supply
Thermal padTPAD—Thermal pad. Connect to ground on board.